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Grinding Pad Product List

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ダイヤ研削パッド『SQUADRO-M/H』:脱遊離砥粒の有力手法

脱遊離!既存装置の定盤に貼り付け可能。金属・セラミックなど各種素材の高品質加工を簡単・クリーン・効率的に実現するダイヤ研削パッド

SQUADRO-MおよびSQUADRO-Hは、ミクロンレベルの微細研磨が可能な革新的なダイヤモンド研削パッドです。従来のラッピング方法の代替手段として、研磨レート、表面品質、ワークピースの形状および寿命の点で優れた結果をもたらします。SQUADROダイヤモンド研削パッドは、簡単に交換でき、クリーンな微細研磨を可能にします。 【特徴】 ■金属、硬質素材、セラミックス等の研磨に最適 ■他の研削パッドに比べ、製品寿命が長く経済的 ■スラリーによるラッピングよりもクリーン ■高い平坦度と表面品質、精密なエッジ ■既存装置の定盤に貼り付けることで、簡単に脱遊離砥粒が実現可能 【主な用途】 SQUADRO-M: 金属の精密研磨 SQUADRO-H: 硬質素材、セラミックス等の精密研磨 ※研削パッドSQUADROは、用途に合わせて3種類の硬さのボンド材にてご提供しております。  詳しくはカタログをご覧いただくか、お気軽にお問合せください。

  • Grindstone

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Metal composite material grinding pad "IRINO": Enhancing the performance of existing grinding machines.

Achieves high polishing rates and excellent surface finish on materials such as SiC and sapphire!

At Pureon, we propose a rapid thinning process that combines IRINO-PROSiC and diamond slurry PURE-DS-RT for high-speed grinding of SiC wafers, achieving significant cost reductions compared to conventional processing methods. This innovative combination not only ensures excellent surface quality but also guarantees a high processing rate, making it suitable for applications that require a smooth transition to the CMP process. The back side features a self-adhesive tape, allowing IRINO-PROSiC to be easily attached to existing metal plates, enhancing the usability and efficiency of SiC grinding tools. Whether you seek superior surface quality or high processing rates, IRINO-PROSiC is the ideal product for advanced SiC processing. 【Features】 ■ Innovative grinding pad suitable for the Rapid Thinning process ■ Optimal for grinding SiC ■ Surface finish at Ra 1 nm level ■ Highly competitive compared to conventional grinding processes ■ Flat finish that does not cause edge surface degradation ■ Usable on single-sided/double-sided polishing machines with flat plates (dressing required)

  • IRINO-PRO-SiC_004.jpg
  • Other abrasives

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Diamond grinding pad "SQUADRO-G2": A powerful method for removing free abrasive grains.

Detach and release! Can be attached to the existing device's base plate. A diamond grinding pad that enables high-quality processing of glass materials easily, cleanly, and efficiently.

SQUADRO-G2 is the second generation product of the innovative and efficient diamond grinding pad SQUADRO-G. The new manufacturing process allows for more flexible provision of products in various sizes. In terms of performance, SQUADRO-G2 maintains a high grinding rate until the moment of use, resulting in high surface quality. With its long product lifespan and ease of use, SQUADRO-G2 serves as an economical and efficient alternative to other grinding pads and traditional lapping methods. 【Features】 ■ Compatible with various outer diameter sizes ■ Longer lifespan and more economical compared to other grinding pads ■ Cleaner than slurry lapping ■ High flatness and surface quality, precise edges ■ Easily achieves non-free abrasive by adhering to existing equipment's base plates 【Main Applications】 Optical glass, BK7, quartz glass, aluminum nitride, lithium tantalate, etc. *The grinding pad SQUADRO is available in three different bond hardnesses to suit various applications. For more details, please refer to the catalog or feel free to contact us.

  • SQUADRO_G2_002.jpg
  • Dressing stone.jpg
  • Dressing stone and coolant.jpg
  • SQUADRO-LUB+ JP.jpg
  • Grindstone

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Diamond Grinding Pad 'SQUADRO-M2/H2'

De-bonding! Can be attached to the existing device's base plate. A diamond grinding pad that enables high-quality processing of various materials such as metal and ceramics easily, cleanly, and efficiently.

The SQUADRO-M2 and SQUADRO-H2 are second-generation products of SQUADROM and SQUADRO-H, known for their excellent polishing performance. This innovative diamond grinding pad optimizes precision polishing of metals, hard materials, ceramics, and more. It combines the advantages of both SQUADRO-M and SQUADRO-H. The new manufacturing process allows for more flexible provision of products in various sizes. In terms of usage, the SQUADRO-M2 and SQUADRO-H2 maintain a high polishing rate until the moment they are finished, resulting in high surface quality. Due to their long product lifespan and ease of use, SQUADRO-M2 and SQUADRO-H2 offer an economical and efficient alternative to other grinding pads and traditional lapping methods. 【Features】 - Ideal for polishing metals, hard materials, ceramics, etc. - Compatible with all outer diameter sizes - Longer lifespan and more economical compared to other grinding pads - Cleaner than slurry lapping - High flatness and surface quality, precise edges - Easy detachment of abrasive grains can be achieved by adhering to the existing equipment's base plate 【Main Applications】 Please refer to the catalog.

  • SQUADRO_M2_002.jpg
  • Dressing stone.jpg
  • Dressing stone and coolant.jpg
  • SQUADRO-LUB+ JP.jpg
  • Grindstone

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Easily attach and detach pads! 'PAD-EASE-PRO'

Easily attach and detach grinding pads and polishing pads! Managing the flat surface is a breeze!

PAD-EASE-PRO has been developed to allow for quick and easy replacement of Pureon grinding and polishing pads, such as SQUADRO, IRINO, and PLATO, on a flat surface. The sheet has a special surface treatment that enables repeated attachment and detachment of the pads to the flat surface. Attaching the pads requires careful attention to details such as aligning the slurry hole positions and managing air bubbles. PAD-EASE-PRO simplifies this process, making it possible to use multiple sizes of grinding pads on a single flat surface. Additionally, when removing PAD-EASE-PRO from the flat surface, it leaves minimal adhesive residue, making it easy to clean. It can be provided to match your company's flat surface size. 【Features】 ■ Easy attachment and detachment of Pureon self-adhesive pads ■ Ability to use multiple pads on a single flat surface ■ Easy cleaning of the adhered flat surface ■ Proven track record of use in mass production with double-sided machines

  • Other abrasives

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ダイヤ研削パッド『SQUADRO-O/OWH』:脱遊離砥粒の手法

脱遊離!既存装置の定盤に貼り付け可能。蛍石などの光学材料の高品質加工を簡単・クリーン・効率的に実現するダイヤ研削パッド

SQUADRO-OおよびSQUADRO-OWHは、光学材料に特化したダイヤモンド研削パッドです。 キレの良いレジンボンドに精密分級ダイヤモンド用いており、優れた表面品質、正確な形状、非常に高い研磨レートを実現します。光学材料の平面および球面のどちらにでも使用でき、簡単かつクリーンで効率的な研磨を提供します。 【特徴】 ■光学産業向けの素材に最適(フッ化カルシウム、セレン化亜鉛、シリコン、ゲルマニウム、ヒ化ガリウム等) ■他の研削パッドに比べ、製品寿命が長く経済的 ■スラリーによるラッピングよりもクリーン ■高い平坦度と表面品質、精密なエッジ ■既存装置の定盤に貼り付けることで、簡単に脱遊離砥粒が実現可能 【主な用途】 フッ化カルシウム、セレン化亜鉛、シリコン、ゲルマニウム、ヒ化ガリウムなどの光学材料の精密研磨 ※研削パッドSQUADROは、用途に合わせて3種類の硬さのボンド材にてご提供しております。  詳しくはカタログをご覧いただくか、お気軽にお問合せください。

  • Grindstone

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Diamond grinding pad "PLATO": A grinding pad that can also cut sapphire.

Metal bond grinding pads with high grindability, long lifespan, and compatibility with almost all cooling lubricants (coolants).

This is a polishing pad recommended for grinding workpieces made of ceramics, glass, and various metals. It maintains a high polishing rate due to diamond abrasives fixed with a metal bond. In addition to maintaining high grindability and long lifespan, it is compatible with almost all cooling lubricants (coolants) due to its metal bond specification. 【Features】 ■ High grindability capable of polishing sapphire ■ Always flat and precise edges ■ More economical than grinding paper or slurry ■ Environmentally friendly as it does not require slurry *For more details, please feel free to contact us.

  • PLATO_makro_007.jpg
  • Grindstone

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